Method for forming a semiconductor-on-insulator (SOI) substrate

ABSTRACT

Various embodiments of the present application are directed towards a method for forming a semiconductor-on-insulator (SOI) substrate with a thick device layer and a thick insulator layer. In some embodiments, the method includes forming an insulator layer covering a handle substrate, and epitaxially forming a device layer on a sacrificial substrate. The sacrificial substrate is bonded to a handle substrate, such that the device layer and the insulator layer are between the sacrificial and handle substrates, and the sacrificial substrate is removed. The removal includes performing an etch into the sacrificial substrate until the device layer is reached. Because the device layer is formed by epitaxy and transferred to the handle substrate, the device layer may be formed with a large thickness. Further, because the epitaxy is not affected by the thickness of the insulator layer, the insulator layer may be formed with a large thickness.

REFERENCE TO RELATED APPLICATION

This Application is a Continuation of U.S. application Ser. No.16/139,357, filed on Sep. 24, 2018, which claims the benefit of U.S.Provisional Application No. 62/724,332, filed on Aug. 29, 2018. Thecontents of the above-referenced Patent Applications are herebyincorporated by reference in their entirety.

BACKGROUND

Integrated circuits have traditionally been formed on bulk semiconductorsubstrates. In recent years, semiconductor-on-insulator (SOI) substrateshave emerged as an alternative to bulk semiconductor substrates. An SOIsubstrate comprises a handle substrate, an insulator layer overlying thehandle substrate, and a device layer overlying the insulator layer.Among other things, an SOI substrate leads to reduced parasiticcapacitance, reduced leakage current, reduced latch up, and improvedsemiconductor device performance (e.g., lower power consumption andhigher switching speed).

BRIEF DESCRIPTION OF THE DRAWINGS

Aspects of the present disclosure are best understood from the followingdetailed description when read with the accompanying figures. It isnoted that, in accordance with the standard practice in the industry,various features are not drawn to scale. In fact, the dimensions of thevarious features may be arbitrarily increased or reduced for clarity ofdiscussion.

FIG. 1 illustrates a cross-sectional view of some embodiments of asemiconductor-on-insulator (SOI) substrate with a thick device layer.

FIG. 2 illustrates a cross-sectional view of some alternativeembodiments of the SOI substrate of FIG. 1 in which a trap-rich layerseparates a handle substrate of the SOI substrate and an insulator layerof the SOI substrate.

FIG. 3 illustrates a top view of some embodiments of the SOI substrateof FIG. 1.

FIG. 4 illustrates a cross-sectional view of some embodiments of asemiconductor structure in which the SOI substrate of FIG. 1 findsapplication.

FIGS. 5-16 illustrate a series of cross-sectional views of someembodiments of a method for forming and using an SOI substrate with athick device layer.

FIG. 17 illustrates a block diagram of some embodiments of the method ofFIGS. 5-16.

DETAILED DESCRIPTION

The present disclosure provides many different embodiments, or examples,for implementing different features of this disclosure. Specificexamples of components and arrangements are described below to simplifythe present disclosure. These are, of course, merely examples and arenot intended to be limiting. For example, the formation of a firstfeature over or on a second feature in the description that follows mayinclude embodiments in which the first and second features are formed indirect contact, and may also include embodiments in which additionalfeatures may be formed between the first and second features, such thatthe first and second features may not be in direct contact. In addition,the present disclosure may repeat reference numerals and/or letters inthe various examples. This repetition is for the purpose of simplicityand clarity and does not in itself dictate a relationship between thevarious embodiments and/or configurations discussed.

Further, spatially relative terms, such as “beneath,” “below,” “lower,”“above,” “upper” and the like, may be used herein for ease ofdescription to describe one element or feature's relationship to anotherelement(s) or feature(s) as illustrated in the figures. The spatiallyrelative terms are intended to encompass different orientations of thedevice in use or operation in addition to the orientation depicted inthe figures. The apparatus may be otherwise oriented (rotated 90 degreesor at other orientations) and the spatially relative descriptors usedherein may likewise be interpreted accordingly.

According to a method for forming a semiconductor-on-insulator (SOI)substrate, a device substrate is oxidized to form an oxide layersurrounding the device substrate. Hydrogen ions are implanted into thedevice substrate to form a hydrogen-rich region buried in the devicesubstrate. The device substrate is bonded to a handle substrate throughthe oxide layer, and the device substrate is split along thehydrogen-rich region to partially remove a portion of the oxide layerand a portion of the device substrate from the handle substrate. Achemical mechanical polish (CMP) is performed into a portion of thedevice substrate remaining on the handle substrate to flatten theremaining portion. The remaining portion of the device substrate definesa device layer of the SOI substrate, and a portion of the oxide layerremaining on the handle substrate defines an insulator layer of the SOIsubstrate.

A challenge with the method is that the method is limited to forming thedevice layer and the insulator layer with small thicknesses. Forexample, the device layer and the insulator layer may respectively belimited to a device layer thickness less than about 2700 angstroms andan insulator layer thickness less than about 6800 angstroms. The smallthicknesses may, for example, arise due to the use of ion implantationto form the hydrogen-rich region. The device layer thickness is definedby the depth to which ions are implanted. Therefore, since ionimplantation is limited to a small depth, the device layer is limited toa small thickness. Further, the ions are implanted through the insulatorlayer, which dissipates some of the implant energy. Due to thisdissipation, the depth to which ions may be implanted decreases as thethickness of the insulator layer increases and limits the insulatorlayer to a small thickness.

The small thicknesses limit use of the SOI substrate. For example, thesmall thickness of the device layer may limit devices on the devicelayer to small semiconductor junctions (e.g., small PN junctions),whereby use of the SOI substrate may be limited for applicationsdepending upon large semiconductor junctions. As another example, thesmall thickness of the insulator layer may limit electrical isolationbetween devices on the device layer, whereby use of the SOI substratemay be limited for applications depending upon low leakage current.Applications where the small thicknesses pose challenges include, forexample, high voltage (e.g., greater than about 100 volts) applications,bipolar complementary metal-oxide-semiconductor (CMOS) double-diffusedmetal-oxide-semiconductor (DMOS) (BCD) applications, embedded flash(eFlash) applications, CMOS image sensor (CIS) applications, nearinfrared (NIR) applications, and other applications. A solution to thesmall thicknesses is to perform epitaxial regrowth to increase athickness of the device layer. However, this increases costs and reducesmanufacturing throughput.

Various embodiments of the present application are directed towards amethod for forming a SOI substrate with a thick device layer and a thickinsulator layer. In some embodiments, the method includes forming aninsulator layer fully covering a handle substrate, and epitaxiallyforming a device layer on a sacrificial substrate. The sacrificialsubstrate is bonded to a handle substrate, such that the device layerand the insulator layer are between the sacrificial and handlesubstrates, and the sacrificial substrate is removed. The removalincludes performing an etch into the sacrificial substrate until thedevice layer is reached. In some embodiments, the method furtherincludes etching edge portions of the device layer and stopping on theinsulator layer, such that the handle substrate is fully coveredthroughout the etching.

Because the device layer is formed by epitaxy and transferred to thehandle substrate, the device layer may be formed with a large thickness(e.g., a thickness greater than about 0.3 micrometers). Epitaxy is notsubject to the thickness restrictions associated with other approachesfor forming the device layer (e.g., approaches forming the device layerusing ion implantation). Further, because the epitaxy is not affected bythe thickness of the insulator layer, the insulator layer may be formedwith a large thickness (e.g., a thickness greater than about 1micrometer). Because the sacrificial substrate is removed using theetch, the removal may be highly controlled and total thickness variation(TTV) of the device layer may be low. The TTV may, for example, be thedifference between a smallest thickness value across the device layerand a largest thickness value across the device layer. Because thehandle substrate remains fully covered throughout the etching of theedge portions, arcing at the handle substrate may be avoided inembodiments in which the handle substrate has a high resistance and theetching is performed by dry etching. Further, arcing at the handlesubstrate may be avoided for subsequent plasma processing (e.g., plasmaetching) used to form semiconductor devices on the SOI substrate.

With reference to FIG. 1, a cross-sectional view 100 of some embodimentsof a SOI substrate 102 is provided. The SOI substrate 102 may, forexample, be used with high voltage devices, BCD devices, eFlash devices,CMOS image sensors, NIR image sensors, and other devices. The highvoltage devices may, for example, be devices operating at voltagesgreater than about 100 volts. In some embodiments, the SOI substrate 102has a circular top layout and/or has a diameter of about 200, 300, or450 millimeters. In other embodiments, the SOI substrate 102 has someother shape and/or some other dimensions. Further, in some embodiments,the SOI substrate 102 is a semiconductor wafer. The SOI substrate 102comprises a handle substrate 104, an insulator layer 106, and a devicelayer 108. The handle substrate 104 may be or comprise, for example,monocrystalline silicon, some other silicon material, some othersemiconductor material, or any combination of the foregoing.

In some embodiments, the handle substrate 104 has a high resistanceand/or a low oxygen concentration. The high resistance may, for example,be greater than about 1, 3, 4, or 9 kilo-ohms/centimeter (kΩ/cm), and/ormay, for example, be about 1-4 kΩ/cm, about 4-9 kΩ/cm, or about 1-9kΩ/cm. The low oxygen concentration may, for example, be less than about1, 2, or 5 parts per million atoms (ppma), and/or may, for example, bebetween about 0.1-2.5 ppma, about 2.5-5.0 ppma, or about 0.1-5.0 ppma.The low oxygen concentration and the high resistance individually reducesubstrate and/or radio frequency (RF) losses. In some embodiments, thehandle substrate 104 has a low resistance. The low resistance reducescosts of the handle substrate 104 but may lead to increased substrateand/or RF losses. The low resistance may, for example, be less thanabout 8, 10, or 12 Ω/cm, and/or may, for example, be between about 8-12Ω/cm, about 8-10 Ω/cm, or about 10-12 Ω/cm. In some embodiments, thehandle substrate 104 is doped with p-type or n-type dopants. Theresistance of the handle substrate 104 may, for example, be controlledby a doping concentration of the handle substrate 104. For example,increasing the doping concentration may decrease resistance, whereasdecreasing the doping concentration may increase resistance, or viceversa. In some embodiments, a thickness T_(hs) of the handle substrate104 is about 720-780 micrometers, about 720-750 micrometers, or about750-780 micrometers.

The insulator layer 106 overlies the handle substrate 104 and may be orcomprise, for example, silicon oxide, silicon-rich oxide (SRO), someother oxide, some other dielectric, or any combination of the foregoing.In some embodiments, the insulator layer 106 completely covers an uppersurface 104 us of the handle substrate 104. In at least some embodimentsin which the handle substrate 104 has the high resistance, completelycovering the upper surface 104 us of the handle substrate 104 preventsarcing during plasma processing (e.g., plasma etching) used to formdevices (not shown) on the device layer 108. In some embodiments, theinsulator layer 106 completely encloses the handle substrate 104. Theinsulator layer 106 has a first insulator thickness T_(fi) at a top ofthe handle substrate 104, between the device layer 108 and the handlesubstrate 104. The first insulator thickness T_(fi) is large so as toprovide a high degree of electrical insulation between the handlesubstrate 104 and the device layer 108. The high degree of electricalinsulation may, for example, enable reduced leakage current betweendevices (not shown) on the device layer 108 and/or may, for example,enhance performance of the devices. In some embodiments, the firstinsulator thickness T_(fi) is about 0.2-2.5 micrometers, about 0.2-1.35micrometers, or about 1.35-2.5 micrometers, and/or is greater than about1 or 2 micrometers. In some embodiments, the insulator layer 106 has asecond insulator thickness T_(si) at a bottom of the handle substrate104 and/or along sidewalls of the handle substrate 104. In someembodiments, the second insulator thickness T_(si) is less than thefirst insulator thickness T_(fi). In some embodiments, the secondinsulator thickness T_(si) is about 20-6000 angstroms, about 20-3010angstroms, or about 3010-6000 angstroms.

In some embodiments, the insulator layer 106 has stepped profiles at SOIedge portions 102 e of the SOI substrate 102 that are respectively onopposite sides of the SOI substrate 102. In some embodiments, theinsulator layer 106 has upper surfaces that are at the SOI edge portions102 e and that are recessed below a top surface of the insulator layer106 by a vertical recess amount VR_(i). The vertical recess amountVR_(i) may, for example, be about 20-6000 angstroms, about 20-3010angstroms, or about 3010-6000 angstroms. In some embodiments, the sum ofthe vertical recess amount VR_(i) and the second insulator thicknessT_(si) is equal or about equal to the first insulator thickness T_(fi).In some embodiments, the insulator layer 106 has inner sidewalls thatare at the SOI edge portion 102 e and that are laterally recessedrespectively from outer sidewalls of the insulator layer 106 by aninsulator lateral recess amount LR_(i). The insulator lateral recessamount LR_(i) may, for example, be about 0.8-1.2 millimeters, about0.8-1.0 millimeters, or about 1.0-1.2 millimeters.

The device layer 108 overlies the insulator layer 106 and may, forexample, be or comprise monocrystalline silicon, some other silicon,some other semiconductor material, or any combination of the foregoing.In some embodiments, the device layer 108 and the handle substrate 104are the same semiconductor material (e.g., monocrystalline silicon). Thedevice layer 108 has a thickness T_(d) that is large. The largethickness of the device layer 108 may, for example, enable formation oflarge semiconductor junctions (e.g., PN junctions) upon which certaindevices (e.g., NIR image sensors) may depend. In some embodiments, thethickness T_(d) of the device layer 108 is large in that it is greaterthan about 0.2, 0.3, 1.0, 5.0, or 8.0 micrometers, and/or in that it isabout 0.2-8.0 micrometers, about 0.2-4.0 micrometers, or about 4.0-8.0micrometers. In some embodiments, the device layer 108 has sidewallsthat are at the SOI edge portion 102 e and that are laterally recessedrespectively from sidewalls of the handle substrate 104 by a devicelateral recess amount LR_(d). The device lateral recess amount LR_(d)may, for example, be about 1.4-2.5 millimeters, about 1.4-1.9millimeters, or about 1.9-2.5 millimeters. Further, the device lateralrecess amount LR_(d) may, for example, be larger than the insulatorlateral recess amount LR_(i).

With reference to FIG. 2, a cross-sectional view 200 of some alternativeembodiments of the SOI substrate 102 of FIG. 1 is provided in which atrap-rich layer 202 separates the handle substrate 104 from theinsulator layer 106. The trap-rich layer 202 has a high density ofcarrier traps relative to the handle substrate 104 and/or relative tothe device layer 108. The carrier traps may be or comprise, for example,dislocations and/or other defects in a crystalline lattice of thetrap-rich layer 202. The carrier traps trap mobile carriers (e.g.,mobile electrons) along a top surface of the handle substrate 104 toreduce the effects of parasitic surface conduction (PSC). The mobilecarriers may, for example, be drawn to the top surface of the handlesubstrate 104 by fixed charge in the insulator layer 106. By reducingthe effects of PSC, the trap-rich layer 202 promotes low substrateand/or RF losses, passive device with high Q factors, low crosstalk, andhigh linearity (e.g., low second harmonics).

In some embodiments, the trap-rich layer 202 is or comprises undopedpolycrystalline silicon, amorphous silicon, or some other suitablesemiconductor material that has a high density of carrier traps. In someembodiments in which the trap-rich layer 202 is or comprises undopedpolycrystalline silicon, the carrier traps concentrate at grainboundaries of the undoped polycrystalline silicon and reducing grainsizes of the undoped polycrystalline silicon increases the density ofcarrier traps in the undoped polycrystalline silicon. In someembodiments, a thickness T_(tr) of the trap-rich layer 202 is betweenabout 1-2 micrometers, about 1.0-1.5 micrometers, or about 1.5-2.0micrometers. If the thickness T_(tr) is too small (e.g., less than about1.0 micrometer), the trap-rich layer 202 may be ineffective at trappingmobile carrier and reducing the effect of PSC. If the thickness T_(tr)is too large (e.g., greater than about 2.0 micrometers), the SOIsubstrate 102 may be prone to a high amount of substrate warpage. Insome embodiments, the handle substrate 104 has a high resistance and/ora low oxygen concentration. The high resistance may, for example, begreater than about 1, 3, 4, or 9 kΩ/cm, and/or may, for example, bebetween about 1-4 kΩ/cm, about 4-9 kΩ/cm, or about 1-9 kΩ/cm. The lowoxygen concentration may, for example, be less than about 1, 2, 5, or 10ppma, and/or may, for example, be between about 1-2 ppma, 2-5 ppma, or5-10 ppma.

With reference to FIG. 3, a top view 300 of some embodiments of the SOIsubstrate 102 of FIG. 1 is provided. The SOI substrate 102 is circularand comprises a plurality of IC dies 302 arranged in a grid across thedevice layer 108. For ease of illustration, only some of the IC dies 302are labeled 302. In some embodiments, a diameter D of the SOI substrate102 is about 150, 200, 300, or 450 millimeters. In some embodiments, aninner sidewall 106 isw of the insulator layer 106 is laterally recessedfrom an outer sidewall 106 osw of the insulator layer 106 by aninsulator lateral recess amount LR_(i). In some embodiments, a sidewall108 sw of the device layer 108 is laterally recessed from a sidewall 104sw (shown in phantom) of the handle substrate 104 by a device lateralrecess amount LR_(d). The insulator lateral recess amount LR_(i) may,for example, be about 0.8-1.2 millimeters, about 0.8-1.0 millimeters, orabout 1.0-1.2 millimeters. The device lateral recess amount LR_(d) may,for example, be greater than the insulator lateral recess amount LR_(i)and/or may, for example, be about 1.4-2.5 millimeters, about 1.4-1.9millimeters, or about 1.9-2.5 millimeters.

With reference to FIG. 4, a cross-sectional view 400 of some embodimentsof a semiconductor structure in which the SOI substrate 102 of FIG. 1finds application is provided. The semiconductor structure comprises aplurality of semiconductor devices 402 laterally spaced over the devicelayer 108. The semiconductor devices 402 may be, for example,metal-oxide-semiconductor field-effect transistor (MOSFETs), some othermetal-oxide-semiconductor (MOS) devices, some other insulated-gatefield-effect transistors (IGFETs), some other semiconductor devices, orany combination of the foregoing. Further, the semiconductor devices 402may be, for example, high voltage devices, BCD devices, eFlash devices,CMOS image sensors, NIR image sensors, some other devices, or anycombination of the foregoing.

In some embodiments, the semiconductor devices 402 comprisecorresponding source/drain regions 404, correspondingselectively-conductive channels 406, corresponding gate dielectriclayers 408, corresponding gate electrodes 410, and corresponding spacers412. For ease of illustration, only some of the source/drain regions 404are labeled 404, only one of the selectively-conductive channels 406 islabeled 406, only one of the gate dielectric layers 408 is labeled 408,only one of the gate electrodes 410 is labeled 410, and only one of thespacers 412 is labeled 412. The source/drain regions 404 and theselectively-conductive channels 406 are in the device layer 108. Thesource/drain regions 404 are respectively at ends of theselectively-conductive channels 406, and each of theselectively-conductive channels 406 extends from one of the source/drainregions 404 to another one of the source/drain regions 404. Thesource/drain regions 404 have a first doping type and directly adjoinportions of the device layer 108 having a second doping type oppositethe first doping type.

The gate dielectric layers 408 respectively overlie theselectively-conductive channels 406, and the gate electrodes 410respectively overlie the gate dielectric layers 408. The gate dielectriclayers 408 may be or comprise, for example, silicon oxide and/or someother dielectric material, and/or the gate electrodes 410 may be orcomprise, for example, doped polysilicon, metal, some other conductivematerial, or any combination of the foregoing. The spacers 412 overliethe source/drain regions 404 and respectively line sidewalls of the gateelectrodes 410 and sidewalls of the gate dielectric layers 408. Thespacers 412 may be or comprise, for example, silicon oxide, siliconnitride, silicon oxynitride, silicon carbide, some other dielectric, orany combination of the foregoing.

A back-end-of-line (BEOL) interconnect structure 414 covers the SOIsubstrate 102 and the semiconductor devices 402. The BEOL interconnectstructure 414 comprises an interconnect dielectric layer 416, aplurality of wires 418, and a plurality of vias 420. For ease ofillustration, only some of the wires 418 are labeled 418, and only someof the vias 420 are labeled 420. The interconnect dielectric layer 416may be or comprise, for example, borophosphosilicate glass (BPSG),phosphor-silicate glass (PSG), undoped silicon glass (USG), some otherlow κ dielectric, silicon oxide, some other dielectric, or anycombination of the foregoing. As used herein, a low κ dielectric may beor comprise, for example, a dielectric with a dielectric constant κ lessthan about 3.9, 3, 2, or 1.

The wires 418 and the vias 420 are alternatingly stacked in theinterconnect dielectric layer 416 and define conductive paths extendingto the semiconductor devices 402. The conductive paths may, for example,electrically couple the semiconductor devices 402 to other devices(e.g., other semiconductor devices), contact pads, or some otherstructures. The wires 418 and the vias 420 may be or comprise, forexample, copper, aluminum copper, aluminum, tungsten, some other metal,or any combination of the foregoing. In some embodiments, topmost wiresof the wires 418 are thicker than underlying wires of the wires 418.

While FIGS. 3 and 4 are described with regard to embodiments of the SOIsubstrate 102 in FIG. 1, it is to be understood that embodiments of theSOI substrate 102 in FIG. 2 may alternatively be used in FIGS. 3 and 4.While FIG. 3 illustrates a specific number of IC dies 302 and a specificlayout of IC dies 302, more or less IC dies 302 and/or other layouts ofdies 302 is/are amenable in other embodiments. While FIG. 4 illustratesa specific layout of the BEOL interconnect structure 414, other layoutsof the BEOL interconnect structure 414 are amenable in otherembodiments. While FIG. 4 illustrates three semiconductor devices 402and a specific layout for the semiconductor devices 402, more or lesssemiconductor devices and/or other layouts for the semiconductor devices402 is/are amenable.

With reference to FIGS. 5-16, a series of cross-sectional views 500-1600of some embodiments of a method for forming and using an SOI substrate102 is provided. While the method is illustrated as forming embodimentsof the SOI substrate 102 in FIG. 1, the method may alternatively formembodiments of the SOI substrate 102 in FIG. 2 and other embodiments ofthe SOI substrate 102. Further, while the cross-sectional views 500-1600shown in FIGS. 5-16 are described with reference to a method, it will beappreciated that the structures shown in FIGS. 5-16 are not limited tothe method and may stand alone without the method.

As illustrated by the cross-sectional view 500 of FIG. 5, a handlesubstrate 104 is provided. In some embodiments, the handle substrate 104is or comprises monocrystalline silicon, some other silicon material,some other semiconductor material, or any combination of the foregoing.In some embodiments, the handle substrate 104 has a circular top layoutand/or has a diameter of about 200, 300, or 450 millimeters. In otherembodiments, the handle substrate 104 has some other shape and/or someother dimensions. Further, in some embodiments, the handle substrate 104is a semiconductor wafer. In some embodiments, the handle substrate 104has a high resistance and/or a low oxygen concentration. The highresistance and the low oxygen concentration individually reducesubstrate and/or RF losses. The high resistance may, for example, begreater than about 1, 3, 4, or 9 kΩ/cm, and/or may, for example, bebetween about 1-4 kΩ/cm, about 4-9 kΩ/cm, or about 1-9 kΩ/cm. The lowoxygen concentration may, for example, be less than about 1, 2, or 5ppma, and/or may, for example, be between about 0.1-2.5 ppma, about2.5-5.0 ppma, or about 0.1-5.0 ppma. In some embodiments, the handlesubstrate 104 has a low resistance to reduce substrate costs since ahigh resistance substrate may, for example, be costlier than a lowresistance substrate. The low resistance may, for example, be less thanabout 8, 10, or 12 Ω/cm, and/or may, for example, be about 8-12 Ω/cm,about 8-10 Ω/cm, or about 10-12 Ω/cm. In some embodiments, the handlesubstrate 104 is doped with p-type or n-type dopants. The resistance ofthe handle substrate 104 may, for example, be controlled by a dopingconcentration of the handle substrate 104. In some embodiments, athickness T_(hs) of the handle substrate 104 is about 720-780micrometers, about 720-750 micrometers, or about 750-780 micrometers.

Also illustrated by the cross-sectional view 500 of FIG. 5, a firstinsulator layer 106 a is formed on an upper surface 104 us of the handlesubstrate 104. In some embodiments, the first insulator layer 106 acompletely covers the upper surface 104 us of the handle substrate 104.In at least some embodiments where the handle substrate 104 has the highresistance, completely covering the upper surface 104 us may, forexample, prevent arcing during plasma processing performed hereafter. Insome embodiments, the first insulator layer 106 a completely enclosesthe handle substrate 104. In some embodiments, the first insulator layer106 a is or comprises silicon oxide and/or some other dielectric. Insome embodiments, a thickness T_(fi′) of the first insulator layer 106 ais about 0.2-2.0 micrometers, about 0.2-1.1 micrometers, or about1.1-2.0 micrometers.

In some embodiments, a process for forming the first insulator layer 106a comprises depositing the first insulator layer 106 a by thermaloxidation, chemical vapor deposition (CVD), physical vapor deposition(PVD), some other deposition process, or any combination of theforegoing. For example, the first insulator layer 106 a may be depositedby a dry oxidation process using oxygen gas (e.g., O₂) or some other gasas an oxidant. As another example, the first insulator layer 106 a maybe deposited by a wet oxidation process using water vapor as an oxidant.In some embodiments, the first insulator layer 106 a is formed attemperatures of about 800-1100 degrees Celsius (° C.), about 800-950°C., or about 950-1100° C. For example, where the first insulator layer106 a is formed by thermal oxidation (e.g., any one of the wet and dryoxidation processes), the first insulator layer 106 a may be formed atthese temperatures.

As illustrated by the cross-sectional view 600 of FIG. 6, a sacrificialsubstrate 602 is provided. In some embodiments, the sacrificialsubstrate 602 is or comprises monocrystalline silicon, some othersilicon material, some other semiconductor material, or any combinationof the foregoing. In some embodiments, the sacrificial substrate 602 isdoped with p-type or n-type dopants and/or has a low resistivity. Thelow resistance may, for example, be less than about 0.01 or 0.02 Ω/cmand/or may, for example, be about 0.01-0.2 Ω/cm. In some embodiments,the sacrificial substrate 602 has a lower resistance than the handlesubstrate 104 (see FIG. 5). In some embodiments, the sacrificialsubstrate 602 has a circular top layout and/or has a diameter of about200, 300, or 450 millimeters. In other embodiments, the sacrificialsubstrate 602 has some other shape and/or some other dimensions. In someembodiments, the sacrificial substrate 602 is a bulk semiconductorsubstrate and/or is a semiconductor wafer. In some embodiments, athickness T_(ss) of the sacrificial substrate 602 is about 720-780micrometers, about 720-750 micrometers, or about 750-780 micrometers. Insome embodiments, the thickness T_(ss) of the sacrificial substrate 602is the same or about the same as the thickness T_(hs) of the handlesubstrate 104 (see FIG. 5).

Also illustrated by the cross-sectional view 600 of FIG. 6, a devicelayer 108 is formed on the sacrificial substrate 602. The device layer108 has a thickness T_(d) that is large. In some embodiments, thethickness T_(d) is large in that it is about 0.7-10.0 micrometers, about0.7-5.0 micrometers, or about 5.0-10.0 micrometers, and/or in that it isgreater than about 0.7, 5.0, or 10.0 micrometers. In some embodiments,the device layer 108 is or comprises monocrystalline silicon, some othersilicon material, some other semiconductor material, or any combinationof the foregoing. In some embodiments, the device layer 108 is orcomprises the same semiconductor material as the sacrificial substrate602, has the same doping type as the sacrificial substrate 602, has alower doping concentration than the sacrificial substrate 602, or anycombination of the foregoing. For example, the sacrificial substrate 602may be or comprise P+ monocrystalline silicon, whereas the device layer108 may be or comprise P− monocrystalline silicon. In some embodiments,the device layer 108 has a low resistance. The low resistance may, forexample, be greater than that of the sacrificial substrate 602. Further,the low resistance may, for example, be less than about 8, 10, or 12Ω/cm, and/or may, for example, be about 8-12 Ω/cm, about 8-10 Ω/cm, orabout 10-12 Ω/cm. In some embodiments, the device layer 108 has the samedoping type, the same doping concentration, the same resistivity, or anycombination of the foregoing as the handle substrate 104 (see FIG. 5).In some embodiments, a process for forming the device layer 108comprises molecular beam epitaxy (MBE), vapor phase epitaxy (VPE),liquid phase epitaxy (LPE), some other epitaxial process, or anycombination of the foregoing.

As illustrated by the cross-sectional view 700 of FIG. 7, the devicelayer 108 and the sacrificial substrate 602 are patterned. Thepatterning removes edge regions 604 (see FIG. 6) defined by the devicelayer 108 and the sacrificial substrate 602. By removing the edgeregions 604, defects are prevented from forming at the edge regions 604during subsequent grinding and/or chemical wet etching. The edge defectshave a propensity to concentrate at the edge regions 604 and negativelyimpact the quality of the device layer 108. Further, the patterningforms a ledge 702 at an edge of the sacrificial substrate 602. The ledge702 is defined by the sacrificial substrate 602 and has a pair of ledgesegments respectively on opposite sides of the sacrificial substrate602. In some embodiments, the ledge 702 has a top layout that extendsalong an edge of the sacrificial substrate 602 in a ring-shaped path orsome other closed path. In some embodiments, the ledge 702 has a width Wof about 0.8-1.2 millimeters, about 0.8-1.0 millimeters, or about1.0-1.2 millimeters. In some embodiments, the ledge 702 is recessedbelow an upper or top surface of the device layer 108 by a distance D ofabout 30-120 micrometers, about 30-75 micrometers, or about 75-120micrometers. In some embodiments, the ledge 702 is further recessedbelow an upper or top surface of the sacrificial substrate 602.

In some embodiments, the patterning is performed by aphotolithography/etching process or some other patterning process.Further, in some embodiments, the patterning comprises forming a mask704 over the device layer 108, performing an etch into the device layer108 and the sacrificial substrate 602 with the mask 704 in place, andremoving the mask 704. The mask 704 may, for example, be formed so thedevice layer 108 and the sacrificial substrate 602 are completelycovered except for at the edge regions 604. In some embodiments, themask 704 is or comprise silicon nitride, silicon oxide, some other hardmask material, photoresist, some other mask material, or any combinationof the foregoing. In some embodiments, the mask 704 is formed using awafer edge exposure (WEE) process tool. For example, a process forforming the mask 704 may comprise: depositing a photoresist layer on thedevice layer 108; selectively exposing an edge portion of thephotoresist layer to radiation using the WEE process tool; anddeveloping the photoresist layer to form the mask 704.

As illustrated by the cross-sectional view 800 of FIG. 8, the devicelayer 108 and the sacrificial substrate 602 are cleaned to remove etchresidue and/or other undesired byproducts produced while performingpreceding processes (e.g., the patterning of FIG. 7). In someembodiments, the cleaning process scrubs the device layer 108 and thesacrificial substrate 602 using a physical brush or a water jet. In someembodiments, the cleaning process cleans the device layer 108 and thesacrificial substrate 602 using a chemical solution. The chemicalsolution may, for example, be or comprise hydrofluoric acid or someother chemical solution. In some embodiments, the cleaning increases thedistance D at which the ledge 702 is recessed below the upper or topsurface of the device layer 108. In other embodiments, the distance Dremains substantially unchanged from the patterning at FIG. 7.

As illustrated by the cross-sectional view 900 of FIG. 9, a secondinsulator layer 106 b is formed on an upper surface 108 us of the devicelayer 108. In some embodiments, the second insulator layer 106 bcompletely covers the upper surface 108 us of the device layer 108. Insome embodiments, the second insulator layer 106 b completely enclosesthe sacrificial substrate 602 and the device layer 108. In someembodiments, the second insulator layer 106 b is or comprises siliconoxide and/or some other dielectric. In some embodiments, the secondinsulator layer 106 b is the same dielectric material as the firstinsulator layer 106 a. In some embodiments, a thickness T_(si′) of thesecond insulator layer 106 b is about 20-6000 angstroms, about 20-3010angstroms, or about 3010-6000 angstroms.

In some embodiments, a process for forming the second insulator layer106 b comprises depositing the second insulator layer 106 b by thermaloxidation, CVD, PVD, some other deposition process, or any combinationof the foregoing. For example, the second insulator layer 106 b may bedeposited by a dry oxidation process using oxygen gas (e.g., O₂) or someother gas as an oxidant. As another example, the second insulator layer106 b may be deposited by a wet oxidation process using water vapor asan oxidant. In some embodiments, the second insulator layer 106 b isformed at temperatures of about 750-1100° C., about 750-925° C., orabout 925-1100° C. For example, where the second insulator layer 106 bis formed by thermal oxidation (e.g., any one of the wet and dryoxidation processes), the second insulator layer 106 b may be formed atthese temperatures. In some embodiments, the second insulator layer 106b is formed at a temperature less than that of the first insulator layer106 a.

As illustrated by the cross-sectional view 1000 of FIG. 10, thesacrificial substrate 602 is bonded to the handle substrate 104, suchthat the device layer 108, the first insulator layer 106 a, and thesecond insulator layer 106 b are between the handle substrate 104 andthe sacrificial substrate 602. The bonding presses the first and secondinsulator layers 106 a, 106 b together and forms a bond 1002 at aninterface at which the first insulator layer 106 a and the secondinsulator layer 106 b directly contact. The bonding may, for example, beperformed by fusion bonding, vacuum bonding, or some other bondingprocess. The fusion bonding may, for example, be performed with apressure at about 1 standard atmosphere (atm), about 0.5-1.0 atm, about1.0-1.5, or about 0.5-1.5 atm. The vacuum bonding may, for example, beperformed with a pressure at about 0.5-100 millibars (mBar), about0.5-50 mBar, or about 50-100 mBar.

In some embodiments, a bond anneal is performed to strengthen the bond1002. In some embodiments, the bond anneal is performed at a temperatureof about 300-1150° C., about 300-725° C., or about 735-1150° C. In someembodiments, the bond anneal is performed for about 2-5 hours, about2-3.5 hours, or about 3.5-5 hours. In some embodiments, the bond annealis performed with a pressure at about 1 atm, about 0.5-1.0 atm, about1.0-1.5, or about 0.5-1.5 atm. In some embodiments, the bond anneal isperformed while nitrogen gas (e.g., N₂) and/or some other gas flows overthe structure of FIG. 10. The flow rate for the gas may, for example,about 1-20 standard litre per minute (slm), about 1-10 slm, or about10-20 slm.

As illustrated by the cross-sectional view 1100 of FIG. 11, a firstthinning process is performed into the second insulator layer 106 b andthe sacrificial substrate 602. The first thinning process removes anupper portion of the second insulator layer 106 b, and further removesan upper portion of the sacrificial substrate 602. In some embodiments,the first thinning process is performed into the second insulator layer106 b and the sacrificial substrate 602 until the device layer 108 andthe sacrificial substrate 602 collectively have a predeterminedthickness T_(pd). The predetermined thickness T_(pd) may, for example,about 20-45 micrometers, about 20-32.5 micrometers, or about 32.5-45micrometers.

In some embodiments, the first thinning process is partially or whollyperformed by a mechanical grinding process. In some embodiments, thefirst thinning process is performed partially or wholly performed by achemical mechanical polish (CMP). In some embodiments, the firstthinning process is performed by a mechanical grinding process followedby a CMP. As noted above, removal of the edge region 604 of FIG. 6prevents edge defects from forming at the edge region 604 during thegrinding. The edge defects have a propensity to form and concentrate atthe edge region 604 during the grinding and negatively impact thequality of the device layer 108.

As illustrated by the cross-sectional view 1200 of FIG. 12, an etch isperformed into the sacrificial substrate 602 (see FIG. 11). The etchstops on the device layer 108 and remove the sacrificial substrate 602.In some embodiments, the etch further removes a portion of the secondinsulator layer 106 b on sidewalls of the sacrificial substrate 602 andsidewalls of the device layer 108. Further, in some embodiments, theetch laterally etches sidewalls 108 sw of the device layer 108. Due tothe lateral etching, the sidewalls 108 sw of the device layer 108 may,for example, be curved and/or concave. Upon completion of the etch, thethickness T_(d) of the device layer 108 may, for example, be about0.6-9.5 micrometers, about 0.6-5.05 micrometers, or about 5.05-9.5micrometers. In some embodiments, the etch minimally reduces thethickness T_(d) of the device layer 108 due to, for example, overetching.

In some embodiments, the etch is performed by ahydrofluoric/nitric/acetic (HNA) etch, some other wet etch, a dry etch,or some other etch. The HNA etch may, for example, etch the sacrificialsubstrate 602 with a chemical solution comprising hydrofluoric acid,nitric acid, and acetic acid. The etch has a first etch rate formaterial of the sacrificial substrate 602, and further has a second etchrate for material of the device layer 108 that is less than the firstetch rate. In some embodiments, the first etch rate is about 90-100,90-95, or 95-100 times greater than the second etch rate. Theseembodiments of the first and second etch rates may, for example, arisewhen the first etch is performed by the HNA etch, the sacrificialsubstrate 602 is or comprises P+ monocrystalline silicon, and the devicelayer 108 is or comprises P− monocrystalline silicon.

Due to the use of the etch (e.g., the HNA etch) to remove thesacrificial substrate 602, the removal of the sacrificial substrate 602may, for example, be highly controlled. Therefore, the thickness T_(d)of the device layer 108 may, for example, be highly uniform across thedevice layer and a TTV of the device layer 108 may, for example, be low.The TTV may, for example, be low in that it is less than about 500 or1500 angstroms. In some embodiments, the TTV decreases with thethickness T_(d) of the device layer 108. For example, the TTV may beless than about 500 angstroms where the thickness T_(d) of the devicelayer 108 is less than about 3000 angstroms, and the TTV may be greaterthan about 500 angstroms, but less than about 1500 angstroms, where thethickness T_(d) of the device layer 108 is more than about 3000angstroms.

As illustrated by the cross-sectional view 1300 of FIG. 13, the devicelayer 108 is patterned. The patterning removes edge portions 108 e (seeFIG. 12) of the device layer 108. By removing the edge portions 108 e,edge defects that form at the edge portions 108 e during the etch ofFIG. 12 are removed. The edge defects reduce the quality of the devicelayer 108 and form due to lateral etching into the sidewalls 108 sw ofthe device layer 108 during the etch of FIG. 12. The patterning furtherlaterally recesses the sidewalls 108 sw of the device layer 108. In someembodiments, after removing the edge portions 108 e, the sidewalls 108sw of the device layer 108 are laterally recessed respectively fromsidewalls of the handle substrate 104 by a device lateral recess amountLR_(d). The device lateral recess amount LR_(d) may, for example, beabout 1.4-2.5 millimeters, about 1.4-1.95 millimeters, or about 1.95-2.5millimeters.

In some embodiments, the patterning is performed by aphotolithography/etching process or some other patterning process.Further, in some embodiments, the patterning comprises forming a mask1302 over the device layer 108, performing an etch into the device layer108 with the mask 1302 in place, and removing the mask 1302. The mask1302 may, for example, be or comprise silicon nitride, silicon oxide,some other hard mask material, photoresist, some other mask material, orany combination of the foregoing. The mask 1302 may, for example, beformed so the device layer 108 is completely covered, except for at theedge portions 108 e, and/or may, for example, be formed using a WEEprocess tool. In some embodiments, a process for forming the mask 1302using the WEE process tool comprises: depositing a photoresist layer onthe device layer 108; selectively exposing an edge portion of thephotoresist layer to radiation using the WEE process tool; anddeveloping the photoresist layer to form the mask 1302. The etch may,for example, be performed by a dry etch or some other etch, and/or may,for example, stop on the first and second insulator layers 106 a, 106 b.In some embodiments where the handle substrate 104 has a high resistance(e.g., a resistance greater than about 1 kΩ/cm) and the etch isperformed using a dry etch, the first and second insulator layers 106 a,106 b prevent arcing by completely covering and/or completely enclosingthe handle substrate 104. The mask 1302 may, for example, be removed byplasma ashing or some other removal. The plasma ashing may, for example,comprise exposure of the mask 1302 to O₂ plasma and may, for example, beperformed when mask 1302 is or comprise photoresist.

In some embodiments, a cleaning process is performed after thepatterning of FIG. 13 to remove etch residue and/or other undesiredbyproducts produced during the patterning. In some embodiments, thecleaning process removes oxide that forms on the device layer 108 duringthe patterning. The cleaning process may, for example, perform thecleaning using HF acid or some other chemical solution. Hydrogenfluoride may, for example, make about up 0.1-2.0%, about 0.1-1.0%, orabout 1.0-2.0% of the HF acid by volume. A remainder of the HF acid may,for example, be deionized water or some other water.

As illustrated by the cross-sectional view 1400 of FIG. 14, a secondthinning process is performed into the device layer 108 to reduce thethickness T_(d) of the device layer 108. In some embodiments, the secondthinning process reduces the thickness T_(d) to about 0.3-8.0micrometers, about 0.3-4.15 micrometers, or about 4.15-8.0 micrometers,and/or to greater than about 0.3, 1.0, 2.0, 5.0, or 8.0 micrometers.Collectively, the device layer 108, the first insulator layer 106 a, thesecond insulator layer 106 b, and the handle substrate 104 define an SOIsubstrate 102. In some embodiments, the second thinning process isperformed by a CMP, some other thinning process, or any combination ofthe foregoing.

Because the device layer 108 is formed by epitaxy and transferred to thehandle substrate 104, the device layer 108 may be formed with a largethickness (e.g., a thickness greater than about 0.3 micrometers).Epitaxy is not subject to the thickness restrictions associated withother approaches for forming the device layer. Further, because theepitaxy is not affected by the thickness of the first and secondinsulator layers 106 a, 106 b, the first and second insulator layers 106a may be individually and/or collectively formed with a large thickness(e.g., a thickness greater than about 1 micrometer). The large thicknessof the device layer 108 may, for example, enable formation of largesemiconductor junctions (e.g., PN junctions) upon which certain devices(e.g., NIR image sensors) may depend. The large thickness of the firstand second insulator layers 106 a may, for example, facilitate enhancedelectrical isolation between devices on the device layer 108 and/orreduce leakage current between the devices. Devices that may benefitfrom the large thicknesses include, for example, high voltage devices,BCD devices, eFlash devices, CMOS image sensors, NIR image sensors, someother devices, or any combination of the foregoing.

As illustrated by the cross-sectional 1500 of FIG. 15, a plurality ofsemiconductor devices 402 are formed on the device layer 108. In someembodiments in which the handle substrate 104 has a high resistance(e.g., a resistance greater than about 1 kΩ/cm), the first and secondinsulator layers 106 a, 106 b prevent arcing during plasma processing(e.g., plasma etching) performed to form the semiconductor devices 402by completely covering and/or completely enclosing the handle substrate104. The semiconductor devices 402 may be, for example, high voltagedevices, BCD devices, eFlash devices, CMOS image sensors, NIR imagesensors, some other devices, or any combination of the foregoing. Thehigh voltage devices may, for example, be devices that operate at morethan about 100 volts.

In some embodiments, the semiconductor devices 402 comprisecorresponding source/drain regions 404, correspondingselectively-conductive channels 406, corresponding gate dielectriclayers 408, corresponding gate electrodes 410, and corresponding spacers412. For ease of illustration, only some of the source/drain regions 404are labeled 404, only one of the selectively-conductive channels 406 islabeled 406, only one of the gate dielectric layers 408 is labeled 408,only one of the gate electrodes 410 is labeled 410, and only one of thespacers 412 is labeled 412. The source/drain regions 404 and theselectively-conductive channels 406 are in the device layer 108. Thesource/drain regions 404 are respectively at ends of theselectively-conductive channels 406, and each of theselectively-conductive channels 406 extends from one of the source/drainregions 404 to another one of the source/drain regions 404. The gatedielectric layers 408 respectively overlie the selectively-conductivechannels 406, and the gate electrodes 410 respectively overlie the gatedielectric layers 408. The spacers 412 overlie the source/drain regions404 and respectively line sidewalls of the gate electrodes 410.

In some embodiments, a process for forming the semiconductor devices 402comprises depositing a dielectric layer covering the device layer 108,and further depositing a conductive layer covering the dielectric layer.The conductive layer and the dielectric layer are patterned (e.g., by aphotolithography/etching process) into the gate electrodes 410 and thegate dielectric layers 408. Dopants are implanted into the device layer108 with the gate electrodes 410 in place to define lightly dopedportions of the source/drain regions 404, and a spacer layer is formedcovering the source/drain regions 404 and the gate electrodes 410. Thespacer layer is etched back to form the spacers 412, and dopants areimplanted into the device layer 108 with the spacers 412 in place toexpand the source/drain regions 404.

As illustrated by the cross-sectional view 1600 of FIG. 16, a BEOLinterconnect structure 414 is formed over the device layer 108 and thesemiconductor devices 402. The BEOL interconnect structure 414 comprisesan interlayer dielectric (ILD) layer 416 ild, a plurality of interwiredielectric (IWD) layers 416 iwd, and a passivation layer 416 p. The IWDlayers 416 iwd overlie the ILD layer 416 i1d, and the passivation layer416 p overlies the IWD layers 416 iwd. The ILD layer 416 i1d, the IWDlayers 416 iwd, and the passivation layer 416 p may be or comprise, forexample, BPSG, PSG, USG, some other low κ dielectric, silicon oxide,some other dielectric, or any combination of the foregoing. The BEOLinterconnect structure 414 further comprises a plurality of wires 418and a plurality of vias 420. For ease of illustration, only some of thewires 418 are labeled 418, and only some of the vias 420 are labeled420. The wires 418 and the vias 420 are alternatingly stacked in aninterconnect dielectric layer defined by the ILD layer 416 ild, the IWDlayers 416 iwd, and the passivation layer 416 p.

In some embodiments, a process for forming the BEOL interconnectstructure 414 comprises forming a bottommost layer of the vias 420 by asingle damascene process, and subsequently forming a bottommost layer ofthe wires 418 by the single damascene process. Further, in someembodiments, the process comprises forming remaining layers of the vias420 and remaining layers of the wires 418 by repeatedly performing adual damascene process. In some embodiments, the single damasceneprocess comprises depositing a dielectric layer, patterning thedielectric layer with openings for a single layer of conductive features(e.g., a layer of vias or wires), and filling the openings withconductive material to form the single layer of conductive features. Thedielectric layer may, for example, corresponds to the ILD layer 416 ildor a bottom IWD layer of the IWD layers 416 iwd. In some embodiments,the dual damascene process comprises depositing a dielectric layer,patterning the dielectric layer with openings for two layers ofconductive features (e.g., a layer of vias and a layer of wires), andfilling the openings with conductive material to form the two layers ofconductive features. The dielectric layer may, for example, correspondto one of the IWD layers 416 iwd over the bottom IWD layer.

With reference to FIG. 17, a block diagram 1700 of some embodiments ofthe method of FIGS. 5-16 is provided. The method may, for example, forma SOI substrate with a thick device layer and a thick insulator layer.

At 1702, a first insulator layer is formed covering (e.g., completelycovering) a handle substrate. See, for example, FIG. 5.

At 1704, a device layer is epitaxially formed on a sacrificialsubstrate. See, for example, FIG. 6.

At 1706, edge regions defined by the device layer and the sacrificialsubstrate are removed. See, for example, FIG. 7.

At 1708, the device layer and the sacrificial substrate are cleaned.See, for example, FIG. 8.

At 1710, a second insulator layer is formed covering the device layer.See, for example, FIG. 9.

At 1712, the sacrificial substrate is bonded to the handle substrate,such that the first insulator layer, the second insulator layer, and thedevice layer are sandwiched between the sacrificial substrate and thehandle substrate. See, for example, FIG. 10.

At 1714, the sacrificial substrate is thinned. See, for example, FIG.11.

At 1716, an etch is performed into the sacrificial substrate to removethe sacrificial substrate, thereby uncovering the device layer. See, forexample, FIG. 12.

At 1718, edge portions of the device layer are removed, where the handlesubstrate remains covered (e.g., completely covering) by the first andsecond insulator layers throughout the removal. See, for example, FIG.13. Arcing at the handle substrate may, for example, be prevented by thefirst and second insulator layers in embodiments in which the handlesubstrate has a high resistance (e.g., a resistance greater than about 1kΩ/cm), the removal is performed by dry etching, and the handlesubstrate is completely covered by the first and second insulator layersthroughout the removal.

At 1720, the device layer is thinned. See, for example, FIG. 14. Thedevice layer, the first and second insulator layers, and the handlesubstrate collectively define an SOI substrate. Because the device layeris formed by epitaxy and transferred to the handle substrate, the devicelayer may be formed with a large thickness (e.g., a thickness greaterthan about 0.3 micrometers). Epitaxy is not subject to the thicknessrestrictions associated with other approaches for forming the devicelayer. Further, because the epitaxy is not affected by the thickness ofthe insulator layer, the insulator layer may be formed with a largethickness (e.g., a thickness greater than about 1 micrometer).

At 1722, a semiconductor device is formed on the device layer. See, forexample, FIG. 15. In some embodiments, the semiconductor devices areformed using plasma processing. For example, plasma etching may be usedto pattern a dielectric layer and a conductive layer respectively into agate dielectric layer and a gate electrode. Arcing at the handlesubstrate may, for example, be prevented by the first and secondinsulator layers in embodiments in which the handle substrate has a highresistance (e.g., a resistance greater than about 1 kΩ/cm), thesemiconductor devices are formed using plasma processing, and the handlesubstrate is completely covered by the first and second insulator layersthroughout the plasma processing.

At 1724, a BEOL interconnect structure is formed covering the devicelayer and the semiconductor device. See, for example, FIG. 16.

While the block diagram 1700 of FIG. 17 is illustrated and describedherein as a series of acts or events, it will be appreciated that theillustrated ordering of such acts or events is not to be interpreted ina limiting sense. For example, some acts may occur in different ordersand/or concurrently with other acts or events apart from thoseillustrated and/or described herein. Further, not all illustrated actsmay be required to implement one or more aspects or embodiments of thedescription herein, and one or more of the acts depicted herein may becarried out in one or more separate acts and/or phases.

In some embodiments, the present application provides a method forforming a SOI substrate, the method including: forming an insulatorlayer on a handle substrate; epitaxially forming a device layer on asacrificial substrate; bonding the sacrificial substrate to the handlesubstrate, such that the device layer and the insulator layer arebetween the sacrificial and handle substrates; and removing thesacrificial substrate, wherein the removing includes performing an etchinto the sacrificial substrate until the device layer is reached. Insome embodiments, the sacrificial substrate and the device layercomprise the same semiconductor material, wherein the sacrificialsubstrate and the device layer have the same doping types but differentdoping concentrations. In some embodiments, the sacrificial substrateincludes P+ monocrystalline silicon, and wherein the device layerincludes P− monocrystalline silicon. In some embodiments, the etchemploys a HNA etchant. In some embodiments, the removing furtherincludes grinding the sacrificial substrate before the etch. In someembodiments, the insulator layer is formed completely covering a topsurface of the handle substrate, wherein the method further includes:patterning the device layer to remove edge portions of the device layer,wherein the top surface of the insulator layer remains completelycovered throughout the patterning. In some embodiments, the patterningincludes a dry etch into the device layer, and wherein the dry etchstops on the insulator layer. In some embodiments, the patterningincludes forming a mask on the device layer using a WEE process tool. Insome embodiments, the handle substrate has a high resistance greaterthan about 1 kΩ/cm. In some embodiments, the insulator layer completelyencloses the handle substrate.

In some embodiments, the present application provides a SOI substrateincluding: a handle substrate; an insulator layer covering the handlesubstrate, wherein the insulator layer has a pair of edge portions alongan upper surface of the insulator layer, and wherein the edge portionsare respectively on opposite sides of the insulator layer and each has astepped profile; and a device layer overlying the insulator layer. Insome embodiments, the insulator layer includes: a pair of first uppersurface portions uncovered by the device layer, wherein the first uppersurface portions are respectively on the opposite sides of the insulatorlayer; and a pair of second upper surface portions uncovered by thedevice layer, wherein the second upper surface portions are respectivelyon the opposite sides of the insulator layer, wherein the first uppersurface portions are laterally between the second upper surface portionsand are elevated relative to the second upper surface portions. In someembodiments, the insulator layer completely encloses the handlesubstrate. In some embodiments, a thickness of the insulator layer isgreater than about 0.7 micrometers, and a thickness of the device layeris greater than about 0.3 micrometers. In some embodiments, the handlesubstrate includes silicon and has a resistance greater than about 1kΩ/cm.

In some embodiments, the present application provides a method forforming a SOI substrate, the method including: forming a dielectriclayer covering a first semiconductor substrate; epitaxially forming asemiconductor layer on a second semiconductor substrate, wherein thesemiconductor layer and the second semiconductor substrate have the samedoping types, and wherein the second semiconductor substrate is highlydoped relative to the semiconductor layer; bonding the secondsemiconductor substrate to the first semiconductor substrate, such thatthe semiconductor layer and the dielectric layer are between the firstsemiconductor substrate and the second semiconductor substrate;performing a first etch into the second semiconductor substrate untilthe semiconductor layer is reached; and performing a second etch intothe semiconductor layer to remove edge portions of the semiconductorlayer, wherein the second etch stops on the dielectric layer. In someembodiments, the dielectric layer completely covers the firstsemiconductor substrate throughout the second etch, wherein the firstsemiconductor substrate has a high resistance greater than about 1kΩ/cm, and wherein the second etch is performed with a dry etchant. Insome embodiments, the first etch has a first etch rate for the secondsemiconductor substrate and a second etch rate for the semiconductorlayer, wherein the first etch rate is about 90 or more times greaterthan the second etch rate. In some embodiments, the semiconductor layerand the second semiconductor substrate are doped with p-type dopants,wherein the first etch employs a HNA etchant. In some embodiments, themethod further includes: patterning the semiconductor layer and thesecond semiconductor substrate to define a ledge, wherein the ledge isrecessed below an upper surface of the second semiconductor substrate,and wherein the ledge has a pair of ledge segments respectively onopposite sides of the second semiconductor substrate; and, afterdefining the ledge, forming a second dielectric layer covering thesemiconductor layer, wherein the bonding is performed such that thesecond dielectric layer is between the first semiconductor substrate andthe second semiconductor substrate.

The foregoing outlines features of several embodiments so that thoseskilled in the art may better understand the aspects of the presentdisclosure. Those skilled in the art should appreciate that they mayreadily use the present disclosure as a basis for designing or modifyingother processes and structures for carrying out the same purposes and/orachieving the same advantages of the embodiments introduced herein.Those skilled in the art should also realize that such equivalentconstructions do not depart from the spirit and scope of the presentdisclosure, and that they may make various changes, substitutions, andalterations herein without departing from the spirit and scope of thepresent disclosure.

What is claimed is:
 1. A method for forming a semiconductor-on-insulator(SOI) substrate, the method comprising: depositing a first insulatorlayer on a handle substrate, wherein the first insulator layercompletely surrounds the handle substrate; forming a device layer on asacrificial substrate, wherein the sacrificial substrate and the devicelayer comprise semiconductor material; depositing a second insulatorlayer completely surrounding the device layer and the sacrificialsubstrate; bonding the sacrificial substrate to the handle substrate,such that the device layer and the first insulator layer are between thesacrificial substrate and the handle substrate, wherein the first andsecond insulator layers directly contact upon completion of the bonding;and performing a first etch into the sacrificial substrate until thedevice layer is reached to remove the sacrificial substrate, wherein thefirst etch employs a hydrofluoric/nitric/acetic (HNA) etchant; whereinthe device layer is directly exposed to the HNA etchant.
 2. The methodaccording to claim 1, wherein the sacrificial substrate and the devicelayer have different doping concentrations.
 3. The method according toclaim 1, wherein the first etch has a first etch rate for thesacrificial substrate and a second etch rate for the device layer, andwherein the first etch rate is 90 or more times greater than the secondetch rate.
 4. The method according to claim 1, further comprising:performing a second etch into the device layer to remove edge portionsof the device layer, wherein the first insulator layer completely coversthe handle substrate throughout the second etch.
 5. The method accordingto claim 1, further comprising: patterning the device layer and thesacrificial substrate to define a ledge, wherein the ledge is recessedbelow an upper surface of the sacrificial substrate, and wherein theledge has a pair of ledge segments respectively on opposite sides of thesacrificial substrate; wherein the second insulator layer is depositedafter defining the ledge, and is further deposited covering the devicelayer and having a stepped profile conforming to the ledge, wherein thebonding is performed such that the second insulator layer is between thehandle substrate and the sacrificial substrate.
 6. The method accordingto claim 1, further comprising: performing a grinding process into thesacrificial substrate to partially remove the sacrificial substrate,wherein the grinding process is performed between the first etch and thebonding, and wherein the first etch removes a remainder of thesacrificial substrate.
 7. A method for forming asemiconductor-on-insulator (SOI) substrate, the method comprising:depositing a first insulator layer on a handle substrate; forming adevice layer on a sacrificial substrate, wherein the sacrificialsubstrate and the device layer comprise semiconductor material; bondingthe sacrificial substrate to the handle substrate, such that the devicelayer and the first insulator layer are between the sacrificial andhandle substrates; removing the sacrificial substrate; and performing afirst etch into the device layer to remove edge portions of the devicelayer after the removing, wherein the first etch stops on the firstinsulator layer and the handle substrate is completely covered by thefirst insulator layer throughout the first etch; wherein the firstinsulator layer completely encloses the handle substrate throughout theremoving and the first etch.
 8. The method according to claim 7, whereina sidewall of the device layer has a planar profile before the removing,wherein the sidewall has a concave profile upon completion of theremoving, and wherein the sidewall has a planar profile upon completionof the first etch.
 9. The method according to claim 7, wherein the firstinsulator layer directly contacts a first sidewall of the handlesubstrate and remains on the first sidewall throughout the removing,wherein the method further comprises: depositing a second insulatorlayer covering the device layer, wherein the second insulator layerdirectly contacts a second sidewall of the device layer, and wherein theremoving clears the second insulator layer from the second sidewall. 10.The method according to claim 9, wherein the removing comprises:performing a grinding process, wherein the grinding process partially,but not entirely, removes the sacrificial substrate and the secondinsulator layer, and wherein the second insulator layer has a firstsidewall segment and a second sidewalls segment extending respectivelyalong opposite sidewalls of the device layer, and further has a bottomsegment extending along a bottom surface of the device layer from thefirst sidewall segment to the second sidewall segment, upon completionof the grinding process.
 11. The method according to claim 9, whereinthe second insulator layer is deposited completely surrounding thedevice layer and the sacrificial substrate.
 12. The method according toclaim 7, wherein the sacrificial substrate has a first portion with afirst width, and further has a second portion protruding towards thehandle substrate from a bottom of the first portion and with a secondwidth less than the first width, during the bonding.
 13. The methodaccording to claim 7, further comprising: forming a semiconductor deviceon and partially defined by the device layer after the first etch; andforming an interconnect structure covering and electrically coupled tothe semiconductor device.
 14. A method for forming asemiconductor-on-insulator (SOI) substrate, the method comprising:forming an insulator layer covering a handle substrate, wherein theinsulator layer has a pair of edge portions along a top of the insulatorlayer; and forming a device layer overlying the insulator layer; whereinthe edge portions are respectively on opposite sides of the insulatorlayer and each edge portion has a stepped profile stepping downwardbeginning at a top surface of the insulator layer, which faces anddirectly contacts a bottom surface of the device layer, wherein a firstedge portion of the pair of edge portions has a sidewall extending fromthe top surface of the insulator layer and facing a same direction as asidewall of the device layer on a common side of the device layer as thesidewall of the device layer, and wherein the sidewall of the first edgeportion and the sidewall of the device layer are laterally offset fromeach other.
 15. The method according to claim 14, wherein the insulatorlayer comprises: a pair of first upper surface portions uncovered by thedevice layer, wherein the first upper surface portions are respectivelyon the opposite sides of the insulator layer; and a pair of second uppersurface portions uncovered by the device layer, wherein the second uppersurface portions are respectively on the opposite sides of the insulatorlayer, and wherein the first upper surface portions are laterallybetween the second upper surface portions and are elevated relative tothe second upper surface portions.
 16. The method according to claim 15,wherein the first upper surface portions are part of a first ring-shapedportion of the insulator layer, and wherein the second upper surfaceportions are part of a second ring-shaped portion of the insulator layerthat is recessed relative to the first ring-shaped portion.
 17. Themethod according to claim 14, wherein the insulator layer completelyencloses the handle substrate.
 18. The method according to claim 14,further comprising: providing the device layer atop a sacrificialsubstrate; bonding the sacrificial substrate to the handle substrate,such that the device layer is between the sacrificial and handlesubstrates; and removing the sacrificial substrate after the bonding,wherein the removing includes etching the sacrificial substrate using anHNA etchant, and wherein the device layer is exposed to the HNA etchantduring the etching.
 19. The method according to claim 14, furthercomprising: providing a sacrificial substrate atop the device layer;removing the sacrificial substrate; and performing a first etch into thedevice layer after the removing, wherein the first etch removes edgeportions of the device layer, wherein a sidewall of the device layer hasa planar profile before the removing, wherein the sidewall of the devicelayer has a concave profile upon completion of the removing, and whereinthe sidewall of the device layer has a planar profile upon completion ofthe first etch.
 20. The method according to claim 14, wherein a portionof the insulator layer at the device layer is formed by a differentdeposition than a portion of the insulator layer at the handlesubstrate.